SUNNYVALE, Calif., May 31, 2018 /PRNewswire-iReach/ -- Promex, a provider of innovative IC packaging and heterogeneous assembly solutions for medical, biotech, and sensor-based microelectronic devices, announces that Promex Chief Technology Officer Annette Teng has been selected to receive the 2018 Electronics Packaging Society Regional Contributions Award for Regions 1-6, 7 and 9.
According to EPS President Avi Bar-Cohen and EPS Awards Program Chair Eric Perfecto, this peer-nominated award recognizes significant and outstanding leadership and contributions to the growth and impact of EPS programs and activities at the regional level. The award will be announced during the EPS Luncheon at ECTC on Thursday, May 31 at the Sheraton San Diego Hotel & Marina, San Diego, CA.
"Rarely do individuals make as many different, yet significant, contributions to the IEEE Packaging Society as has Dr. Teng. She's served as chapter officer, organized of chapter meetings, initiated new chapter relationships, established a student chapter at San Jose State University, and contributed to the revitalization of EPS' IEMT Conference by presenting papers on packaging. Dr. Teng does all of this in addition to creatively contributing to Promex customers worldwide as our chief technology officer," said Promex President and CEO Richard Otte.
Dr. Teng has served on IEEE-CPMT Santa Clara Chapter's executive committee from 2001-2008 and again from 2014-2015, and also served as the Chapter's chairperson from 2016-2018. In addition, she established the "Sister Chapter" relationship between the Santa Clara and Malaysian Chapters, supported the Malaysian Chapter's initial growth, revitalized EPS' IEMT conference by moving it from the US to Malaysia and established the San Jose State EPS Student Chapter.
Dr. Teng's contributions to the growth and revitalization of the EPS Monthly Seminar Program at Texas Instruments in Santa Clara significantly increased member attendance. For example, in October 2017 she was the featured speaker at an IEEE event on wafer thinning and singulation -- a critical process for successful miniaturization and high-density packaging. Dr. Teng compared dicing yields and cost of various die singulation techniques, including stealth laser, laser abrasion, plasma etch and conventional rotary blade. Her white paper on the various ways Die Attach Film (DAF) can be implemented for complex microelectronic assemblies can be downloaded from https://promex-ind.com/knowledge-center/white-papers/
ABOUT PROMEX
Promex is exhibiting in Booth 408 at the Electronic Components and Technology Conference (ECTC) today through Friday, June 1, 2018. Promex specializes in design, packaging and assembly services for a variety of applications including microelectronic subassemblies; Class II & III implantables and wearables; custom sensors and transducers; microfluidic, ultrasound and disposable devices; high-resolution imaging arrays; and camera and diagnostic equipment. Also exhibiting in Booth 408 is the Promex Quik-Pak Division, a provider of prototype services for RF devices and sensors supporting 5G and IoT.
Located in Silicon Valley since 1975, Promex provides design for manufacturing services coupled with materials science expertise and broad assembly capabilities for small- to mid-volume onshore production. Services include RoHS-optimized SMT, wafer thinning, dicing, wirebond, flip chip, overmolding and Class 100/Class 1000 cleanrooms. IC packaging, including overmolded QFNs, are available in five days from the Promex Quik-Pak Division in San Diego. Promex is ISO 13485:2016 and ISO 9001:2015 certified, IPC certified and ITAR registered. For more information: In Booth 408 at ECTC ask for Promex Director of Sales and Marketing Rosie Medina, or visit http://www.promex-ind.com, or call Promex at 408-496-0222.
ABOUT ECTC
ECTC brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. This international event sponsored by the IEEE Electronics Packaging Society (formerly CPMT) runs May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina, San Diego, CA. The technical program contains papers covering leading-edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.
Media Contact: Mar Junge, c3PR, 4082190101, mar@c3pr.com
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SOURCE Promex
