SAN JOSE, Calif., March 22, 2016 /PRNewswire/ -- Foxconn Interconnect Technology, Limited ("FIT"), a leading supplier of interconnect solutions, today announced it will demonstrate its latest optical transceiver technologies for next generation data center and enterprise storage applications. The live demonstrations of new technologies will be in the FIT Booth 3841 at the OFC 2016 exhibition in Anaheim, California, USA from March 22nd to 24th.
"The transition to higher Ethernet and Fibre Channel speeds in the data center and enterprise storage networks will drive the need for new optical transceiver solutions with new signaling formats and form factors to address the power and reach requirements. Combining world-class fiber optic interconnect technologies with deep expertise in high-speed transceiver subsystems, FIT has developed a new set of advanced optical transceivers in support of next generation systems and demonstrated its continued commitment to addressing the growing data center market," said Philip Gadd, Vice President and General Manager of Foxconn Interconnect Technology, Limited.
About Foxconn Interconnect Technology, Limited
Foxconn Interconnect Technology, Limited focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components.
For more information, visit FIT's website: http://www.fit-foxconn.com.
FIT Public Relations – US & EU
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SOURCE Foxconn Interconnect Technology, Ltd.