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Foxconn Interconnect Technology, Ltd. Demonstrates Next Generation Data Center Technologies at OFC 2016
Live Demonstrations of Compact 25G SR, 32GFC LR, 100G eSR4, 100G CWDM4 and 300G SR12 Optical Transceiver Technologies Will Be in the FIT Booth 3841

SAN JOSE, Calif., March 22, 2016 /PRNewswire/ -- Foxconn Interconnect Technology, Limited ("FIT"), a leading supplier of interconnect solutions, today announced it will demonstrate its latest optical transceiver technologies for next generation data center and enterprise storage applications. The live demonstrations of new technologies will be in the FIT Booth 3841 at the OFC 2016 exhibition in Anaheim, California, USA from March 22nd to 24th.

Demonstration Highlights

  • Extended-reach 100G QSFP28 eSR4 transceivers operating over 300m MMF
  • 300G CXP2 SR12 pluggable transceiver operating with next generation embedded transceiver at 28 Gb/s per lane
  • Compact 25G SR SFP-like transceiver with LC duplex MMF interface operating at 25 Gb/s
  • 100G QSFP28 CWDM4 transceiver operating at 25 Gb/s per lane
  • Long reach 32G Fibre Channel SFP28 transceiver operating at 28 Gb/s

"The transition to higher Ethernet and Fibre Channel speeds in the data center and enterprise storage networks will drive the need for new optical transceiver solutions with new signaling formats and form factors to address the power and reach requirements. Combining world-class fiber optic interconnect technologies with deep expertise in high-speed transceiver subsystems, FIT has developed a new set of advanced optical transceivers in support of next generation systems and demonstrated its continued commitment to addressing the growing data center market," said Philip Gadd, Vice President and General Manager of Foxconn Interconnect Technology, Limited.

About Foxconn Interconnect Technology, Limited
Foxconn Interconnect Technology, Limited focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components.

For more information, visit FIT's website:

Press Contact:
Pamela Fong
FIT Public Relations – US & EU

Caution Concerning Forward Looking Statements
We are disclosing forward-looking information so that investors, potential investors, and other owners can better understand the mentioned Company's future prospects and make informed investment decisions. The information in this press release contains "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. These statements can be identified by the fact that they do not relate strictly to historical or current facts. Any forward-looking statement made by the Company speaks only as of the date on which it is made. The Company is under no obligation to, and expressly disclaims any obligation to, update or alter its forward-looking statements, whether as a result of new information, subsequent events or otherwise.

SOURCE Foxconn Interconnect Technology, Ltd.